Water-cooling heat dissipating apparatus and vapor chamber thereof

ABSTRACT

Disclosed are a water-cooling heat dissipating apparatus and its vapor chamber. The vapor chamber includes a first casing, a second casing, a capillary tissue and a working fluid, and the second casing is engaged closely with the first casing and a cavity is formed and enclosed by the first casing and the second casing. The second casing includes a substrate and plural heat dissipating fins integrally formed with the substrate, and the capillary tissue is disposed in the first casing and the second casing, and the working fluid is filled into the cavity. The vapor chamber has a curved section and a first section and a second section extended outwardly and respectively from both ends of the curved section. Therefore, the water-cooling heat dissipating apparatus and its vapor chamber have the features of a quick heat transfer by low thermal resistance and an easy and simple manufacturing process.

FIELD OF THE INVENTION

The technical field relates to heat dissipation, more particularly to a water-cooling heat dissipating apparatus and its vapor chamber for heat generating electronic components.

BACKGROUND OF THE INVENTION

As the computing speed of electronic components becomes increasingly higher, the heat generated by the electronic components also becomes greater. To overcome the high heat issue effectively, manufacturers have used heat sinks, heat pipes or vapor chambers made of aluminum and copper alloys extensively, but such heat dissipating structures still require further improvements on their thermal conduction and manufacturability.

The conventional heat sink generally comprises a bottom plate and a heat dissipating fin extended from the bottom plate. Although such conventional heat sink has the feature of good heat dissipation, the thermal conductivity of the heat sink cannot be improved. Therefore, a heat dissipating structure including a vapor chamber and the aforementioned heat sink has been developed, wherein the heat sink is mounted onto the vapor chamber by a soldering material such as a solder paste

Although the conventional heat dissipating structure has the effects of conducting and dissipating heat, its actual application still has the following problems. Since a soldering material is coated onto the interface of the vapor chamber and the heat sink, and such material may hinder the heat transfer. In addition, the vapor chamber and the heat dissipating fin or the vapor chamber and the heat sink are manufactured separately, and then each component is assembled, and thus not only requiring a complicated procedure and consuming time, but also having a risk of peeling the capillary tissue in the vapor chamber when heated. Obviously, the conventional heat dissipating structure requires improvements.

In view of the aforementioned problems of the prior art, the discloser of this disclosure based on years of experience in the related industry to conduct extensive researches and experiments, and finally provided a feasible solution to overcome the problems of the prior art.

SUMMARY OF THE INVENTION

It is a primary objective of this disclosure to provide a water-cooling heat dissipating apparatus and its vapor chamber with the features of a quick heat transfer through low thermal resistance and an easy manufacturing process.

To achieve the aforementioned and other objectives, this disclosure provides a water-cooling heat dissipating apparatus comprising a vapor chamber and a cover, and the vapor chamber includes a first casing, a second casing, a capillary tissue and a working fluid, wherein the second casing is engaged closely with the first casing, and a cavity is formed and enclosed by the first casing and the second casing, and the second casing comprises a substrate and a plurality of heat dissipating fins integrally formed with the substrate, and the capillary tissue is disposed in the first casing and the second casing, and the working fluid is filled into the cavity, and the vapor chamber has at least one curved section, and a first section and a second section are extended outwardly and respectively from both ends of the curved section; and a cover is covered onto the vapor chamber, and a liquid cavity is formed between the cover and the vapor chamber, and the heat dissipating fin is formed in the liquid cavity, and the cover has a water inlet and a water outlet communicated with the liquid cavity.

To achieve the aforementioned and other objectives, this disclosure provides a vapor chamber of a water-cooling heat dissipating apparatus comprising a first casing, a second casing, a capillary tissue and a working fluid, wherein, the second casing is engaged closely with the first casing, and a cavity is formed and enclosed by the first casing and the second casing, and the second casing includes a substrate and a plurality of heat dissipating fins integrally formed with the substrate; the capillary tissue is disposed in the first casing and the second casing; and the working fluid is filled into the cavity; wherein, the vapor chamber has at least one curved section and a first section and a second section are extended outwardly and respectively from both ends of the curved section.

This disclosure has the following effects: Each heat dissipating fin is integrally formed with the substrate, and the vapor chamber transfers the heat source directly, so as to achieve a quick heat transfer with the feature of a low thermal resistance. The water inlet is formed precisely above the heated portion of the vapor chamber, so that after a fluid enters into the liquid cavity, the fluid will flush and impact each heat dissipating fin, so as to dissipate the heat of the heat source to the outside quickly and effectively.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a heat dissipating structure in accordance with a first preferred embodiment of this disclosure;

FIG. 2 is a cross-sectional view of a heat dissipating structure in accordance with the first preferred embodiment of this disclosure;

FIG. 3 is a perspective view of a heat dissipating structure in accordance with a second preferred embodiment of this disclosure;

FIG. 4 is a cross-sectional view of a heat dissipating structure in accordance with a third preferred embodiment of this disclosure; and

FIG. 5 is a cross-sectional view of a heat dissipating structure of this disclosure.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than restrictive.

With reference to FIGS. 1 and 2 for a water-cooling heat dissipating apparatus and its vapor chamber of this disclosure, the vapor chamber 1 comprises a first casing 10, a second casing 20, a capillary tissue 30, 30′ and a working fluid 40.

The first casing 10 and the second casing 20 are made of copper, aluminum, or their alloys. Firstly, a woven mesh, a sintered metal, or a ditch and a support member such as a coil spring pillar (not shown in the figure) are placed in the first casing 10 to form a capillary tissue 30, and the periphery of the first casing 10 is bent and manufactured to form a plurality of side panels 11, and then the first casing 10 is bent into a U-shape.

The second casing 20 includes a substrate 21, and a surface of the substrate 21 is extruded and chipped to form a plurality of heat dissipating fins 22 with an interval apart from one another, and another capillary tissue 30 composed of woven meshes, ditches, or sintered metals is placed into the second casing 20; and then the second casing 20 is bent into a U-shape, and the heat dissipating fins 22 are formed at the bottom side and both lateral sides of the U-shaped second casing 20. The second casing 20 is engaged with first casing 10 closely. In other words, the periphery of the substrate 21 is connected, soldered, and sealed with the periphery of each side panel 11, and a cavity A is formed and enclosed by the first casing 10 and the second casing 20. Now, the vapor chamber 1 has two curved sections 100, and a transverse first section 110 and a longitudinal second section 120 are extended outwardly and respectively from both ends of each curved section 100. In this preferred embodiment, each first section 110 is connected into a whole.

In addition, the working fluid 40 such as pure water is passed through an air-removing and liquid-filling pipe (not shown in the figure) and filled into the cavity A. Finally, the vapor chamber 1 is heated to remove air and soldered and sealed to obtain the product of a vapor chamber 1.

During use, the bottom surface of the first casing 10 is contacted with a heat source, wherein the heat may be carried away quickly by the vapor-liquid phase change occurred inside the vapor chamber 1, and then the heat is dissipated to the outside by the heat dissipating fin 22, so as to improve the heat dissipating performance.

With reference to FIGS. 3 and 4 for two vapor chambers in accordance with two preferred embodiments of this disclosure respectively, the vapor chamber 1 a as shown in FIG. 3 has a plurality of heat sinks 12 formed on both edges of the first casing 10 respectively, and the vapor chamber 1 b as shown in FIG. 4 is L-shaped, and the vapor chamber 1 b has a curved section 100 and a first section 110 and a second section 120 outwardly and respectively extended from both ends of the curved section 100.

With reference to FIG. 5 for a water-cooling heat dissipating apparatus of this disclosure, the water-cooling heat dissipating apparatus comprises a vapor chamber 1 and a cover 5, wherein the cover 5 is covered onto the vapor chamber 1 and engaged with each side panel 11 by aligning the bottom edge of the cover 5 precisely with the first casing 10, and a liquid cavity B is formed between the cover 5 and the vapor chamber 1, and each heat dissipating fin 22 is formed in the liquid cavity B, and a water inlet 51 and two water outlets 52 are formed on the cover 5 and communicated with the liquid cavity B.

In addition, the water-cooling heat dissipating apparatus of this disclosure further comprises a water inlet pipe 6, two water outlet pipe 7 and a partition plate 8, wherein the water inlet pipe 6 is coupled to the water inlet 51, and each water outlet pipe 7 is coupled to the water outlet 52, and the partition plate 8 is clamped between the top of the heat dissipating fin 22 and the cover 5, and a liquid channel 81 is formed at the middle position of the partition plate 8 corresponsive to the water inlet pipe 6. After the fluid enters from the water inlet pipe 6 into the liquid cavity B, the fluid flushes and impacts each heat dissipating fin 22 in the middle area to carry away the primary heat generated by each heat dissipating fin 22 and then flows through the heat dissipating fins 22 in both side areas to carry away the secondary heat, and finally flows along the channel formed by the partition plate 8 and the cover 5 and out from each water outlet pipe 7, so as to achieve the process of flowing the fluid inside the water-cooling heat dissipating apparatus.

While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims. 

What is claimed is:
 1. A water-cooling heat dissipating apparatus, comprising: a vapor chamber, comprising a first casing, a second casing, a capillary tissue and a working fluid, wherein the second casing is engaged closely with the first casing, and a cavity is formed and enclosed by the first casing and the second casing, and the second casing comprises a substrate and a plurality of heat dissipating fins integrally formed with the substrate, and the capillary tissue is disposed in the first casing and the second casing, and the working fluid is filled into the cavity, and the vapor chamber has at least one curved section, and a first section and a second section are extended outwardly and respectively from both ends of the curved section; and a cover, covered onto the vapor chamber, and a liquid cavity being formed between the cover and the vapor chamber, and the heat dissipating fin being formed in the liquid cavity, and the cover having a water inlet and a water outlet communicated with the liquid cavity.
 2. The water-cooling heat dissipating apparatus according to claim 1, further comprising a water inlet pipe and at least one water outlet pipe, and the water inlet pipe being coupled to the water inlet, and the water outlet pipe being coupled to the water outlet.
 3. The water-cooling heat dissipating apparatus according to claim 2, further comprising a partition plate included between a heat exchanger and the cover, and the partition plate has a liquid channel disposed at a position corresponsive to the water inlet pipe.
 4. The water-cooling heat dissipating apparatus according to claim 1, wherein the vapor chamber is substantially U-shaped.
 5. The water-cooling heat dissipating apparatus according to claim 4, wherein the heat dissipating fins are formed with an interval apart from one another on the substrate of the second casing by extruding or chipping.
 6. The water-cooling heat dissipating apparatus according to claim 5, wherein the first casing has a plurality of heat sink formed in the second section.
 7. The water-cooling heat dissipating apparatus according to claim 1, wherein the vapor chamber is substantially L-shaped.
 8. The water-cooling heat dissipating apparatus according to claim 7, wherein the heat dissipating fins are formed with an interval apart from one another on the substrate of the second casing by extruding or chipping.
 9. A vapor chamber of a water-cooling heat dissipating apparatus, comprising: a first casing; a second casing, engaged closely with the first casing, and a cavity being formed and enclosed by the first casing and the second casing, and the second casing including a substrate and a plurality of heat dissipating fins integrally formed with the substrate; a capillary tissue, disposed in the first casing and the second casing; and a working fluid, filled into the cavity; wherein, the vapor chamber has at least one curved section and a first section and a second section are extended outwardly and respectively from both ends of the curved section.
 10. The vapor chamber of a water-cooling heat dissipating apparatus according to claim 9, wherein the vapor chamber is substantially U-shaped.
 11. The vapor chamber of a water-cooling heat dissipating apparatus according to claim 10, wherein the heat dissipating fins are formed with an interval apart from one another on the substrate of the second casing by extruding or chipping.
 12. The vapor chamber of a water-cooling heat dissipating apparatus according to claim 11, wherein the first casing has a plurality of heat sinks formed in the second section.
 13. The vapor chamber of a water-cooling heat dissipating apparatus according to claim 9, wherein the vapor chamber is substantially L-shaped.
 14. The vapor chamber of a water-cooling heat dissipating apparatus according to claim 13, wherein the heat dissipating fins are formed with an interval apart from one another on the substrate of the second casing by extruding or chipping. 